Laser Marking/Engraving, Cutting and Melding Equipment Manufacturer - Han's Laser-Han's Laser Technology Co., Ltd

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Laser cutting machine for wafer HDZ-WUVC

Features : With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation The high-precision X-Y-Z-θworktableand excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system Through vacuum absorption, the wafer cannot moveduring platformmoving Thewafercan be positioned through positioning the mark point on the wafer, which can ensure the cutting precision Automatic loading and unloading, robot carrying andautomatic edge searchingfunction. (only for WUVC200)

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Specifications

Machine model	HDZ-WUVC100	HDZ-WUVC200
Laser power	15W	15W
Laser wavelength	355nm	355nm
XY axis repeated positioning precision	±1µm	±1µm
θ axis repeated positioning precision	±15s	±15s
Cutting line width	>15µm	>15µm
Cutting depth	>25µm	>25µm
Cutting speed *The cutting speed varies from different products	100mm/s	100mm/s
Loading and unloading mode	Manual	Robot carrying; automatic edge searching
Processing product type	2 inch-12 inch wafers	2 inch-12 inch wafers
Power supply	AC 220V，50Hz	AC 220V，50Hz